Difference in Material Parameters Between Contact Debonding and Interface Delamination Using CZM

Hiro_0315
Hiro_0315 Member Posts: 2 **
in Structures

I have been using cohesive elements to simulate contact debonding, but now I would like to apply cohesive elements to interface delamination, also under Mode I fracture conditions. I'm unsure how to set the material parameters properly for interface delamination in this case.

For contact debonding, I have been using the following cohesive material parameters:

  • Debonding mode: Mode I
  • Tangential sliding under compressive normal stress: No
  • Maximum contact stress in the normal direction: 7.2E+08 Pa
  • Contact gap at complete separation: 2E-07 m
  • Maximum equivalent contact stress in tangential direction: 7.2E+08 Pa
  • Tangential sliding distance at complete separation: 2E-07 m
  • Artificial damping ratio: 1E-6E s
  • Power law exponent for mixed-mode delamination: 2

Now, for interface delamination, the required parameters seem to differ:

  • Maximum surface traction in the normal direction
  • Displacement at complete separation in the normal direction
  • Maximum surface traction in the tangential direction
  • Displacement at complete separation in the tangential direction
  • A dimensionless weight parameter
  • Ratio
    (I assume this "ratio" is related to the displacement at which the maximum traction occurs. However, such a parameter does not explicitly appear in the contact debonding setup.)

Question:
How should I interpret and define these material parameters for interface delamination using cohesive elements?
Is there a recommended way to convert or reinterpret the contact debonding parameters (e.g., Pa and m) for use in interface delamination?

Any clarification would be greatly appreciated.

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